Taiwan Semi plans more chip facilities in EU, says Taiwan official – report

Taiwan Semiconductor Manufacturing (NYSE:TSM) is planning more facilities in Europe with a focus on the market for AI chips, Bloomberg News reported, citing a senior Taiwanese official.

“They have started construction of the first fab in Dresden, they are already planning the next few fabs in the future for different market sectors as well,” said Taiwan’s National Science and Technology Council Minister Wu Cheng-wen in an interview on Bloomberg TV, the report added.

Wu did not disclose a timeline for the company’s additional expansion plans in Europe.

TSM noted that it remains focused on its current global expansion projects and has no new investment plans at this time.

Wu noted that AI market, including chips for Nvidia (NVDA) and Advanced Micro Devices (AMD) will be the most vital segment, while other semiconductor companies with alternative designs may also provide opportunities for TSM.

“Maybe they can work on the European market as well, so TSM is looking for that for planning their next few fabs,” Wu added, noting that TSM will need to review if needs to expand in the German city Dresden or build in other parts of the EU, according to the report.

Taiwan’s government is thinking of supporting TSM’s suppliers to invest in a place in the Czech Republic which is close to Dresden, as per Wu.

Wu added that he is also looking to facilitate joint research and development programs for academics in Taiwan and the Czech Republic.

The Taiwanese chipmaker is already investing billions of dollars to establish new websites in the U.S., Japan and Germany, amid partly to hedge against a growing geopolitical tussle with China.

In August, the European Commission said it approved €5B ($5.5B) in German state aid to support the construction and operation of a new microchip manufacturing plant by European Semiconductor Manufacturing Company, or ESMC, in Dresden. ESMC is a joint venture between TSM, Robert Bosch GmbH, NXP Semiconductors (NXPI) and Infineon Technologies (OTCQX:IFNNY). Previously, TSM had noted that the total investment was expected to exceed €10B, or roughly $11B, consisting of equity injection, debt borrowing, and help from the EU and the German government. The fab will be operated by TSM.

Separately, Wu noted that he anticipates Taiwan-based chip companies seeing additional pressure to expand in the U.S., regardless who wins the presidential election in November. Wu added that it in the short run it may be painful for the Taiwanese companies to move there because it would be more expensive to do so.

“But in the long run, maybe it’s good for them, from my point of view, because they can improve themselves,” Wu added.

TSM has so far vowed to invest over $65B to create three facilities in Arizona.