Broadcom delivers 3.5D F2F technology for AI XPUs
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3 weeks ago
- Broadcom (NASDAQ:AVGO) announced on Thursday, the availability of its 3.5D eXtreme Dimension System in Package (XDSiP) platform technology, enabling consumer AI customers to develop next-generation custom accelerators (XPUs).
- The 3.5D XDSiP integrates more than 6000 mm of silicon and up to 12 high bandwidth memory stacks in one packaged device to enable high-efficiency, low-power computing for AI at scale.
- Broadcom said it has achieved a significant milestone by developing and launching the industry’s first Face-to-Face (F2F) 3.5D XPU.
- Broadcom’s 3.5D XDSiP platform achieves significant improvements in interconnect density and power efficiency compared to the Face-to-Back (F2B) approach.
- Some key benefits of Broadcom’s 3.5D XDSiP are enhanced interconnect density, superior power efficiency, reduced latency, and compact form factor.