Apple (AAPL) is in early discussions with Indian chipmakers to assemble and package components for the iPhone, the Economic Times reported, citing people with knowledge of the matter.
It is the first time the U.S. tech giant is thinking of assembling and packaging some chips in India, the report noted, adding that it is not clear which chips will be packaged at the Sanand facility, in the Indian state of Gujarat, though they could be display chips.
Apple held discussions with Murugappa Group-owned CG Semi, which is setting up an outsourced semiconductor assembly and test, or OSAT, facility in Sanand, the report added.
Apple did not immediately respond to a request for comment from Seeking Alpha.
CG Semi told the Indian news outlet that it does not comment on market speculation or discussions with specific customers. “We will make appropriate disclosures as and when there is something concrete to share,” said the company, as per the report.
In April, it was reported that Apple has been making efforts to make most of its iPhones sold in the U.S. at facilities in India by the end of 2026 and is speeding up those plans amid potentially higher tariffs in China, its main manufacturing base.