Applied Materials (NASDAQ:AMAT) on Tuesday said that it has introduced new semiconductor systems aimed at enhancing the performance of AI chips.
The products focus on three key areas that include advanced logic, high-performance DRAM, and packaging.
The Kinex Bonding System, a first-of-its-kind die-to-wafer hybrid bonder, promises better power efficiency and chip performance. Meanwhile, the Centura Xtera Epi system addresses challenges in Gate-All-Around [GAA] transistors at 2nm and beyond, ensuring void-free, uniform growth.
Additionally, the PROVision 10 eBeam metrology system offers sub-nanometer resolution for complex 3D chips, improving yield and accuracy.
