Samsung Electronics (OTCPK:SSNLF) has completed development of its sixth-generation High Bandwidth Memory (HBM4) chips and is entering the preparatory phase for mass production, AJU News reported.
The South Korean tech giant is currently sending HBM4 prototypes to Nvidia (NVDA) for quality testing. Samsung aims to complete HBM4 development before the end of the year, and it may be able to start mass production immediately, subject to Nvidia’s quality testing, according to the Google translated news report. Samsung, reportedly, is also establishing a mass production system for immediate mass manufacturing.
Samsung did not immediately respond to a request for comment from Seeking Alpha.
An Nvidia spokesperson declined to comment in an email to Seeking Alpha.
Samsung completed the Production Readiness Approval, or PRA, phase for HBM4. PRA is the sixth step in the semiconductor development process and the final step before mass production approval, the report noted.
The company’s HBM4 development has gained pace since its successful development of the 10nm-class 6th-generation DRAM, “D1c,” in June. Samsung plans to use D1c, which is a generation ahead of its competitors, to regain its competitive edge with the higher-performance HBM4, according to the report.
In its third quarter earnings results, Samsung had said that HBM4 samples were being shipped to key clients. In addition, the company said that going forward in 2026, the Memory Business would focus on the mass production of HBM4 products with differentiated performance.
In September, Samsung’s rival SK hynix (OTCPK:HXSC.F) said it has completed development and finished preparation for mass production of HBM4, the next-generation memory product vital for AI work. SK hynix is a major supplier of HBM chips to Nvidia. Micron Technology (MU), to a lesser extent, is also a competitor of the two Korean companies in this space.