Micron Technology (MU) has started shipping customer samples of the 256GB SOCAMM2, which it claims is the highest-capacity LPDRAM module.
The module uses what Micron says is the industry’s first monolithic 32Gb LPDDR5X design, delivering low-power memory capacity that can unlock new system architectures.
“Micron’s 256GB SOCAMM2 offering enables the most power-efficient CPU-attached memory solution for both AI and HPC. Today’s announcement highlights Micron’s technology and packaging advancements to deliver the highest-capacity, lowest-power modular memory solution with the smallest footprint in the industry,” said Raj Narasimhan, senior vice president and general manager of Micron’s Cloud Memory Business Unit.
The new module has one-third more capacity than the prior highest capacity 192GB SOCAMM2, 2TB of LPDRAM per 8-channel CPU for larger context windows and complex inference workloads.
It also uses one-third of the power compared with equivalent RDIMMs, while using only one-third of the footprint.