Micron breaks ground on new advanced wafer fab in Singapore

  • Micron Technology (MU) broke ground on an advanced wafer fabrication facility on Monday located within the company’s existing NAND manufacturing complex in Singapore.
  • This new facility represents a planned investment of approximately $24 billion (SG $31 billion) over 10 years and is designed to ultimately provide 700,000 square feet of cleanroom space.
  • Wafer output is scheduled to begin in the second half of calendar 2028, helping Micron address growing market demand for NAND technology driven by the rapid expansion of AI and data-centric applications.
  • This new fab will become an integral part of Micron’s NAND Center of Excellence in Singapore, the company added.
  • Source: Press Release

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